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Layer Count | Description | Item | Description |
|---|---|---|---|
Layer Count | 1-24 Layers | Surface Finish | ENIG, Selective Hard Gold, Siver, HASL, LF HASL,
Carbon ink, OSP |
Material | Nan Ya, ITEQ, ISOLA, Rogers, Aluminum | Impedance Control | 50 Ohen +/- 7% |
* Copper | 1-6 oz | Differential impedance | 50 Ohm +/- 7% |
Panel Thickness | 0.125″ | Solder Mask Clearance | Pad + 4 mil |
Blind and Buried | 2+N+2 copper filed BVH | Minimum Dam | 3mil |
Minimum L/S | 4/4 Mil | Layer Registration | 5 mil |
Minimum Silkscreen | 6 mil | ET SMD Pitch | 8 mil |
Minimum PTH (mechanical) | 8 mil | Warp & Twist | 0.7% |
Minimum PTH (Laser) | 3 mil | Panel Sizes | 18° x 24″ , 20° x 24°, 21° x 24” |
Aspect Ratio | 10 | Special Size | 8° x 10° , 24° x 32° |